Advanced Solderless Breadboard System A range of solderless breadboard modules that can interconnect to suit individual requirements. The basic board AD-01 consists of four blocks of six columns of 28 rows, the sockets in each row being interconnected. The blocks are a standard DIP size apart, although MSI and LSI type chips can be used. At both ends of the blocks, there are two power busses. The Red bus is made up of two separate rows of 12 connecting sockets, and the Black bus is one row of 24 connecting sockets. There is an additional

Breadboard AD-12Ideal for prototypingMounted on blue base boardDimensions: 183 x 168mm

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